It has been shown by experiments, that spherical tungsten microparticlein etching solution under the ultrasonic exposure is possible. The process of obtaining consists of two stages. At the first stage, by centrifuging a suspension of tungsten powder with an average particle size of 0.5 microns in the activator – etching from a water solution of potassium hydroxide and potassium ferricyanide, obtained tungsten thin plate of any shape, thickness 1–3 micrometers.